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Enhancing Electrical and Mechanical Properties of Conductive Textile for Wearable Embedded Systems Through Copper Electroplating

2024 路 Article
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Publication year

2024

CiteScore

5,5

SJR

0,76

SNIP

0,89

Authors

Source: Advanced Engineering Materials

DOI:

Scopus:

Fields of knowledge

General Materials Science Condensed Matter Physics